Aluminum and aluminum alloys are not solderable with conventional soldering alloys due to solid oxide layers. Most of the time, other processing steps or highly aggressive fluxing agents had to be used. Now we can introduce you to our SAC ALG solder wire....
Aluminum and aluminum alloys are not solderable with conventional soldering alloys due to solid oxide layers. Most of the time, other processing steps or highly aggressive fluxing agents had to be used. Now we can introduce you to our SAC ALG solder wire....
Aluminum and aluminum alloys are not solderable with conventional soldering alloys due to solid oxide layers. Most of the time, other processing steps or highly aggressive fluxing agents had to be used. Now we can introduce you to our SAC ALG solder wire....
The new solder strap allows you a new way of working for hand soldering. Owing to the flat strip, which is filled with flux according to F-SW34, can be soldered joints in various models. The especially when lead-free solder dreaded syringes from the flux...
With continuous flux core, with more active fluxEutectic alloy prevents the so-called "sticking" of components Responsive fluxing agent for good flow behavior Sn96.5 Ag3 Cu0.5 with F-SW 26 Also suitable for dirty components Open copper pads can also...
With continuous flux core, with more active flux Eutectic alloy prevents the so-called "sticking" of components Responsive fluxing agent for good flow behavior Sn96.5 Ag3 Cu0.5 with F-SW 26 Also suitable for dirty components Open copper pads can also...
With continuous flux core, with more active flux Eutectic alloy prevents the so-called "sticking" of components Responsive fluxing agent for good flow behavior Sn96.5 Ag3 Cu0.5 with F-SW 26 Also suitable for dirty components Open copper pads can also...
With continuous flux core, with more active fluxEutectic alloy prevents the so-called "sticking" of components Responsive fluxing agent for good flow behavior Sn96.5 Ag3 Cu0.5 with F-SW 26 Also suitable for dirty components Open copper pads can also...
For application of solder paste and flux gel, I.D. approx. 1.5 mmThis text is machine translated.
For application of solder paste and flux gel, I.D. approx. 1.2 mmThis text is machine translated.