Contact spacing: 2.54 mm; Copper coating (thickness): 35 µm; Hole Ø: 1 mm; Material: Phenolic paper; PCB features: w/o Cu-coating; Plastic free packaging: Plastic-free packaging; Product size (length): 100 mm; Product size (width): 60 mm; Type (PCB):...
Contact spacing: 2.54 mm; Copper coating (thickness): 35 µm; Hole Ø: 1 mm; Material: Phenolic paper; Material thickness: 1.5 mm; PCB features: w/o Cu-coating; Plastic free packaging: Plastic-free packaging; Product size (length): 160 mm; Product size...
(L x W) 160 mm x 100 mm
Operating voltage: 5 V DCCommunication mode: I2C10 communication connectionsPin spacing 2.54 mm; ; This text is machine translated.
Additional technical information: Attachment: Without Aufrastpfosten; Max. temperature: +70 °C; Min. temperature: -10 °C; Movement (plus/minus 1): 20 mm; Output (potentiometers): Mono; Power rating (electric): 0.1 W; Product size (height): 6.5 mm; Product...
Additional technical information: Attachment: Without Aufrastpfosten; Max. temperature: +70 °C; Min. temperature: -10 °C; Movement (plus/minus 1): 30 mm; Output (potentiometers): Mono; Power rating (electric): 0.1 W; Product size (height): 6.5 mm; Product...
Enclosure type (semiconductors): SOD 123; Forward current I(F): 150 mA; Forward voltage U(F): 1 V; Forward voltage reference: 10 mA; Manufacturer code (components): TRU; Mounting type: Surface-mount; Operating temperature (max.): +150 °C; Operating temperature...
Enclosure type (semiconductors): SOD 323; Forward current I(F): 150 mA; Forward voltage U(F): 1 V; Forward voltage reference: 10 mA; Manufacturer code (components): TRU; Mounting type: Surface-mount; Operating temperature (max.): +150 °C; Operating temperature...
White; Fastener; Detachable; Bundle Ø range 16 mm (max)
White; Fastener; Detachable; Bundle Ø range 20 mm (max)